ZHCS823H March 2012 – March 2019 SN65HVD72 , SN65HVD75 , SN65HVD78
UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.
| THERMAL METRIC(1) | SN65HVD72, SN65HVD75, SN65HVD78 | UNIT | |||
|---|---|---|---|---|---|
| D (SOIC) | DGK (VSSOP) | DRB (VSON) | |||
| 8 PINS | |||||
| RθJA | Junction-to-ambient thermal resistance | 110.7 | 168.7 | 40 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 54.7 | 62.2 | 49.6 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | — | 3.9 | °C/W |
| RθJB | Junction-to-board thermal resistance | 51.3 | 89.5 | 15.5 | °C/W |
| ψJT | Junction-to-top characterization parameter | 9.2 | 7.4 | 0.6 | °C/W |
| ψJB | Junction-to-board characterization parameter | 50.7 | 87.9 | 15.7 | °C/W |