ZHCSRQ1M september 2005 – february 2023 SN65HVD30 , SN65HVD31 , SN65HVD32 , SN65HVD33 , SN65HVD34 , SN65HVD35
PRODUCTION DATA
| THERMAL METRIC(1) | SN65HVD30, SN65HVD31, SN65HVD32 | SN65HVD33, SN65HVD34, SN65HVD35 | SN65HVD33 | UNIT | |
|---|---|---|---|---|---|
| D (SOIC) | D (SOIC) | RHL (VQFN) | |||
| 8 PINS | 14 PINS | 20 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 116.7 | 93.2 | 73 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 56.3 | 47.5 | 14 | °C/W |
| RθJB | Junction-to-board thermal resistance | 63.4 | 49.4 | 13.7 | °C/W |
| ψJT | Junction-to-top characterization parameter | 8.8 | 11.2 | 0.5 | °C/W |
| ψJB | Junction-to-board characterization parameter | 62.6 | 48.9 | 13.7 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | — | 2.8 | °C/W |