ZHCSE15F July 2015 – May 2018 SN65DP159 , SN75DP159
PRODUCTION DATA.
| THERMAL METRIC(1) | SNx5DP159 | SNx5DP159 | UNIT | |
|---|---|---|---|---|
| RGZ (VQFN) | RSB (WQFN) | |||
| 48 PINS | 40 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 31.1 | 37.3 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance (High-K board(2)) | 18.2 | 23.1 | °C/W |
| RθJB | Junction-to-board thermal resistance (High-K board(2)) | 8.1 | 9.9 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.4 | 0.3 | °C/W |
| ψJB | Junction-to-board characterization parameter | 8.1 | 3.8 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 3.2 | 3.2 | °C/W |