ZHCSXB8E April 2003 – November 2024 RC4580
PRODUCTION DATA
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | RC4580 | UNIT | |||||
|---|---|---|---|---|---|---|---|
| D (SOIC) |
P (PDIP) |
PW (TSSOP) |
DGK (VSSOP) |
DDF (SOT-23) |
|||
| 8 PINS | 8 PINS | 8 PINS | 8 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 109 | 99.2 | 163 | 160.5 | 177.9 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 55.7 | 78.8 | 38 | 70.2 | 96.5 | |
| RθJB | Junction-to-board thermal resistance | 49 | 61.9 | 90.6 | 95.6 | 95.2 | |
| ψJT | Junction-to-top characterization parameter | 10.6 | 44.8 | 1.3 | 8.8 | 9.5 | |
| ψJB | Junction-to-board characterization parameter | 48.6 | 61.2 | 88.9 | 94.0 | 95.0 | |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | — | — | — | — | |