SLTS278J November 2010 – March 2020 PTH08T250W
PRODUCTION DATA.
- 1 Features
- 2 Applications
- 3 Description
- 4 Revision History
- 5 Description (continued)
- 6 Pin Configuration and Functions
- 7 Specifications
- 8 Detailed Description
-
9 Application and Implementation
- 9.1
Typical Application
- 9.1.1
Detailed Design Procedure
- 9.1.1.1 Adjusting the Output Voltage
- 9.1.1.2
Capacitor Recommendations for the PTH08T250W Power Module
- 9.1.1.2.1 Capacitor Technologies
- 9.1.1.2.2 Input Capacitor (Required)
- 9.1.1.2.3 Input Capacitor Information
- 9.1.1.2.4 Output Capacitor (Required)
- 9.1.1.2.5 Output Capacitor Information
- 9.1.1.2.6 TurboTrans Output Capacitance
- 9.1.1.2.7 Non-TurboTrans Output Capacitance
- 9.1.1.2.8 Designing for Fast Load Transients
- 9.1.1.2.9 Capacitor Table
- 9.1.1.3 TurboTrans™ Technology
- 9.1.1.4 TurboTrans™ Selection
- 9.1.1.5 Undervoltage Lockout (UVLO)
- 9.1.1.6 On/Off Inhibit
- 9.1.1.7 Current Sharing
- 9.1.1.8 Prebias Startup Capability
- 9.1.1.9 SmartSync Technology
- 9.1.1.10 Auto-Track™ Function
- 9.1.1
Detailed Design Procedure
- 9.1
Typical Application
- 10Device and Documentation Support
- 11Mechanical, Packaging, and Orderable Information
7.4 Typical Characteristics (VI = 5 V)
(3)(4)
Figure 6. Efficiency versus Output Current 
Figure 8. Power Dissipation versus Output Current 
Figure 10. Ambient Temperature versus Output Current 
Figure 7. Output Ripple versus Output Current 
Figure 9. Ambient Temperature versus Output Current 3. The electrical characteristic data has been developed from actual products tested at 25°C. This data is considered typical for the converter. Applies to Figure 6, Figure 7, and Figure 8.
4. The temperature derating curves represent the conditions at which internal components are at or below the manufacturer's maximum operating temperatures. Derating limits apply to modules soldered directly to a 100-mm x 100-mm double-sided PCB with 2-oz. copper and the direction of airflow from pin 10 to pin 22. For surface mount packages (AS and AZ suffix), multiple vias must be utilized. Refer to the mechanical specification for more information. Applies to Figure 9 and Figure 10.