4 Revision History
Changes from Revision N (October 2021) to Revision O (September 2023)
- 將“器件信息”表更改為封裝信息 表Go
- Changed the Thermal Information table values for the DQE
packageGo
Changes from Revision M (April 2019) to Revision N (October 2021)
- 將提到 I2C 的舊術語實例全局更改為控制器和目標Go
- Changed the Thermal Information table values for the DCT and
DCU packagesGo
- Changed the MIN and MAX values of VIK in the
Electrical Characteristics tableGo
- Changed tPHL to show the package values in the
Switching Characteristics AC Performance (Translating Down) (EN = 3.3
V) tableGo
- Changed tPHL to show the package values in the Switching Characteristics AC Performance (Translating Down) (EN = 2.5 V) tableGo
- Changed tPHL to show the package values in the
Switching Characteristics AC Performance (Translating Up) (EN = 3.3
V) tableGo
- Changed tPHL to show the package values in the
Switching Characteristics AC Performance (Translating Up) (EN = 2.5
V) tableGo
Changes from Revision L (April 2016) to Revision M (April 2019)
- Changed the DQE package family From: VSSON to X2SONGo
- Added new section to Overview
Go
- Changed the labels in Figure 9-4. The red curve is > 2 V, the black curve is ≤ 2 V. Go
Changes from Revision K (October 2014) to Revision L (April 2016)
- 將“導通狀態連接”更改為“導通狀態電阻”Go
- 刪除了機器模型 ESD 等級Go
- 在說明 部分最后一句的“100kHz”后增加了“總線”Go
- 更改了器件信息 表中的封裝尺寸Go
- Replaced pinout diagramsGo
- Added I/O column to the Pin Functions table Go
- Deleted RVH package from Pin Configuration and Functions
section Go
- Moved Tstg from Handling Ratings to Absolute Maximum Ratings
Go
- Added a note following the Electrical Characteristics
tableGo
- Added Figure 7-1 to
the Parameter Measurement Information sectionGo
- Changed Figure 7-2
Go
- Changed "repeater" to "level shifter" in second paragraph of the Overview section Go
- Deleted the last row of the Design Requirements table. Go
- Corrected equation from fknee= 0.5 / RT (10%–80%) to fknee= 0.5 / RT (10%–90%)Go
Changes from Revision J (October 2010) to Revision K (December 2012)
- 添加了引腳配置和功能 部分、處理等級 表、特性說明 部分、器件功能模式、應用和實施 部分、電源相關建議 部分、布局 部分、器件和文檔支持 部分以及機械、封裝和可訂購信息 部分Go