ZHCSTX5C August 2000 – January 2025 OPA627 , OPA637
PRODUCTION DATA
請參考 PDF 數據表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | OPA627 | UNIT | ||
|---|---|---|---|---|
| D (SOIC) | LMC (TO-99) | |||
| 8 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 121.5 | 200 | ℃/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 64.3 | N/A | ℃/W |
| RθJB | Junction-to-board thermal resistance | 65.0 | N/A | ℃/W |
| ψJT | Junction-to-top characterization parameter | 18.0 | N/A | ℃/W |
| ψJB | Junction-to-board characterization parameter | 64.3 | N/A | ℃/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | ℃/W |