4 修訂歷史記錄
Changes from C Revision (January 2019) to D Revision
- Added 向數(shù)據(jù)表添加了 SOT-23 (8) (DDF) 封裝Go
Changes from B Revision (April 2018) to C Revision
- Deleted 從器件信息 表中刪除了 SOT-23 封裝預(yù)覽符號(hào)Go
- Added 向器件信息 表添加了 SC70 封裝Go
- Added DCK package information to Device Comparison TableGo
- Deleted DBV package preview notation from Pin Configuration and Functions sectionGo
- Added DCK package drawing and pin functions to Pin Configuration and Functions sectionGo
- Added DBV (SOT-23) and DCK (SC70) thermal informationGo
Changes from A Revision (October 2017) to B Revision
- Added DGK package to Thermal Information table Go
Changes from * Revision (July 2017) to A Revision
- Deleted 刪除了器件信息 表中的 MCP6291 SC70、SOT-553 和 SOIC 封裝Go
- Deleted 刪除了器件信息 表中的 MCP6292 WSON 和 VSSOP (10) 封裝Go
- Changed 將器件信息 表中的 MCP6294 14 引腳 SOIC 封裝從預(yù)覽更改為生產(chǎn)數(shù)據(jù)Go
- Deleted DCK, DRL, DSG, RTE and 8-pin D packages from Device Comparison table Go
- Deleted DRL (SOT-533) package from MCP6291 pinout image and table in Pin Configuration and Functions section Go
- Deleted MCP6291 DCK (SC70) and D (SOIC) package pinout drawings and pin information from Pin Configuration and Functions sectionGo
- Deleted MCP6292 DSG (WSON) and DGS (VSSOP) package pinout drawings and pin table information in Pin Configuration and Functions section Go
- Deleted package preview note from MCP6294 pinout drawing in Pin Configuration and Functions section Go
- Added MCP6294 Thermal Information table Go