ZHCSGF0D July 2017 – October 2019 MCP6291 , MCP6292 , MCP6294
PRODUCTION DATA.
| THERMAL METRIC(1) | MCP6291 | UNIT | ||
|---|---|---|---|---|
| DBV (SOT-23) | DCK (SC70) | |||
| 5 PINS | 5 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 221.7 | 263.3 | °C/W |
| RθJC(top) | Junction-to-case(top) thermal resistance | 144.7 | 75.5 | °C/W |
| RθJB | Junction-to-board thermal resistance | 49.7 | 51.0 | °C/W |
| ψJT | Junction-to-top characterization parameter | 26.1 | 1.0 | °C/W |
| ψJB | Junction-to-board characterization parameter | 49.0 | 50.3 | °C/W |