ZHCSUS5N February 1989 – February 2024 MAX232
PRODUCTION DATA
請參考 PDF 數據表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | SOIC (D) | SOIC wide (DW) | PDIP (N) | SOP (NS) | UNIT | |
|---|---|---|---|---|---|---|
| 16 PINS | 16 PINS | 16 PINS | 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 84.6 | 71.7 | 60.6 | 88.5 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 43.5 | 37.6 | 48.1 | 46.2 | °C/W |
| RθJB | Junction-to-board thermal resistance | 43.2 | 36.8 | 40.6 | 50.7 | °C/W |
| ψJT | Junction-to-top characterization parameter | 10.4 | 13.3 | 27.5 | 13.5 | °C/W |
| ψJB | Junction-to-board characterization parameter | 42.8 | 36.4 | 40.3 | 50.3 | °C/W |