ZHCSLM9B August 2020 – May 2024 LP8866S-Q1
PRODUCTION DATA
- 1
- 1 特性
- 2 應用
- 3 說明
- 4 Pin Configuration and Functions
- 5 Specifications
-
6 Detailed Description
- 6.1 Overview
- 6.2 Functional Block Diagram
- 6.3
Feature Description
- 6.3.1 Control Interface
- 6.3.2 Function Setting
- 6.3.3 Device Supply (VDD)
- 6.3.4 Enable (EN)
- 6.3.5 Charge Pump
- 6.3.6 Boost Controller
- 6.3.7 LED Current Sinks
- 6.3.8 Brightness Control
- 6.3.9
Protection and Fault Detections
- 6.3.9.1 Supply Faults
- 6.3.9.2
Boost Faults
- 6.3.9.2.1 Boost Overvoltage Faults (BSTOVPL, BSTOVPH)
- 6.3.9.2.2 Boost Overcurrent Faults (BSTOCP)
- 6.3.9.2.3 LEDSET Resistor Missing Faults (LEDSET)
- 6.3.9.2.4 MODE Resistor Missing Faults (MODESEL)
- 6.3.9.2.5 FSET Resistor Missing Faults (FSET)
- 6.3.9.2.6 ISET Resistor Out of Range Faults (ISET)
- 6.3.9.2.7 Thermal Shutdown Faults (TSD)
- 6.3.9.3 LED Faults
- 6.3.9.4 Overview of the Fault and Protection Schemes
- 6.4 Device Functional Modes
- 6.5 Programming
-
7 Application and Implementation
- 7.1 Application Information
- 7.2
Typical Applications
- 7.2.1
Full Feature Application for Display Backlight
- 7.2.1.1 Design Requirements
- 7.2.1.2
Detailed Design Procedure
- 7.2.1.2.1 Inductor Selection
- 7.2.1.2.2 Output Capacitor Selection
- 7.2.1.2.3 Input Capacitor Selection
- 7.2.1.2.4 Charge Pump Output Capacitor
- 7.2.1.2.5 Charge Pump Flying Capacitor
- 7.2.1.2.6 Output Diode
- 7.2.1.2.7 Switching FET
- 7.2.1.2.8 Boost Sense Resistor
- 7.2.1.2.9 Power-Line FET
- 7.2.1.2.10 Input Current Sense Resistor
- 7.2.1.2.11 Feedback Resistor Divider
- 7.2.1.2.12 Critical Components for Design
- 7.2.1.3 Application Curves
- 7.2.2 Application with Basic/Minimal Operation
- 7.2.3
SEPIC Mode Application
- 7.2.3.1 Design Requirements
- 7.2.3.2
Detailed Design Procedure
- 7.2.3.2.1 Inductor Selection
- 7.2.3.2.2 Coupling Capacitor Selection
- 7.2.3.2.3 Output Capacitor Selection
- 7.2.3.2.4 Input Capacitor Selection
- 7.2.3.2.5 Charge Pump Output Capacitor
- 7.2.3.2.6 Charge Pump Flying Capacitor
- 7.2.3.2.7 Switching FET
- 7.2.3.2.8 Output Diode
- 7.2.3.2.9 Switching Sense Resistor
- 7.2.3.2.10 Power-Line FET
- 7.2.3.2.11 Input Current Sense Resistor
- 7.2.3.2.12 Feedback Resistor Divider
- 7.2.3.2.13 Critical Components for Design
- 7.2.3.3 Application Curves
- 7.2.1
Full Feature Application for Display Backlight
- 7.3 Power Supply Recommendations
- 7.4 Layout
- 8 Device and Documentation Support
- 9 Revision History
- 10Mechanical, Packaging, and Orderable Information
封裝選項
機械數據 (封裝 | 引腳)
散熱焊盤機械數據 (封裝 | 引腳)
訂購信息
8.5 靜電放電警告
 |
靜電放電 (ESD) 會損壞這個集成電路。德州儀器 (TI) 建議通過適當的預防措施處理所有集成電路。如果不遵守正確的處理和安裝程序，可能會損壞集成電路。 |
| ESD 的損壞小至導致微小的性能降級，大至整個器件故障。精密的集成電路可能更容易受到損壞，這是因為非常細微的參數更改都可能會導致器件與其發布的規格不相符。 |