ZHCS586H October 2011 – October 2023 LMZ10500
PRODUCTION DATA
| THERMAL METRIC(1) | LMZ10500 | UNIT | ||
|---|---|---|---|---|
| SIL (μSIP) | ||||
| 8 PINS | ||||
| RθJA | Junction-to-ambient thermal resistance | SIL0008G Package | 45.8 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 25 | °C/W | |
| RθJB | Junction-to-board thermal resistance | 9.2 | °C/W | |
| ψJT | Junction-to-top characterization parameter | 1.5 | °C/W | |
| ψJB | Junction-to-board characterization parameter | 9.1 | °C/W | |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 25 | °C/W | |