ZHCS586H October 2011 – October 2023 LMZ10500
PRODUCTION DATA
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
Figure 5-1 SIL
Package,8-Pin μSIP| PIN | TYPE(1) | DESCRIPTION | |
|---|---|---|---|
| NO. | NAME | ||
| 1 | EN | I | Enable input. Set this digital input higher than 1.2 V for normal operation. For shutdown, set low. Pin is internally pulled up to VIN and can be left floating for always-on operation. |
| 2 | VCON | I | Output voltage control pin. Connect to analog voltage from resisitve divider or DAC/controller to set the VOUT voltage. VOUT = 2.5 × VCON. Connect a small (470 pF) capacitor from this pin to SGND to provide noise filtering. |
| 3 | FB | I | Feedback of the error amplifier. Connect directly to output capacitor to sense VOUT. |
| 4 | SGND | I | Ground for analog and control circuitry. Connect to PGND at a single point. |
| 5 | VOUT | O | Output Voltage. Connected to one pin of the integrated inductor. Connect output filter capacitor between VOUT and PGND. |
| 6 | PGND | I | Power ground for the power MOSFETs and gate-drive circuitry. |
| 7 | VIN | I | Voltage supply input. Connect ceramic capacitor between VIN and PGND as close as possible to these two pins. Typical capacitor values are between 4.7 μF and 22 μF. |
| 8 | VREF | O | 2.35 V voltage reference output. Typically connected to VCON pin through a resistive divider to set the output voltage. |
| — | PAD | I | The center pad underneath the SIL0008A package is internally tied to SGND. Connect this pad to the ground plane for improved thermal performance. |