ZHCSKP5D june 2020 – april 2023 LMV321A-Q1 , LMV324A-Q1 , LMV358A-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | LMV358A-Q1 | UNIT | ||
|---|---|---|---|---|
| D (SOIC) | DGK (VSSOP) | |||
| 8 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 151.9 | 196.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 92.0 | 86.2 | °C/W |
| RθJB | Junction-to-board thermal resistance | 95.4 | 118.3 | °C/W |
| ψJT | Junction-to-top characterization parameter | 40.2 | 23.2 | °C/W |
| ψJB | Junction-to-board characterization parameter | 94.7 | 116.7 | °C/W |