ZHCSUE4 August 2024 LMR51606-Q1 , LMR51610-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | LMR516xx-Q1 | UNIT | |
|---|---|---|---|
| DBV(SOT-23-6) | |||
| 6 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 147.8 | °C/W |
| RθJA(Effective) | Junction-to-ambient thermal resistance with EVM | 67.2 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 71.1 | °C/W |
| RθJB | Junction-to-board thermal resistance | 36.6 | °C/W |
| ψJT | Junction-to-top characterization parameter | 14.2 | °C/W |
| ψJB | Junction-to-board characterization parameter | 36.4 | °C/W |