For related documentation see the
following:
- Texas Instruments, Thermal Design by Insight not Hindsight Application
Report
- Texas Instruments, A
Guide to Board Layout for Best Thermal Resistance for Exposed Pad
Packages Application Report
- Texas Instruments, Semiconductor and IC Package Thermal Metrics Application
Report
- Texas
Instruments, Thermal Design Made Simple with LM43603 and LM43602
Application Report
- Texas Instruments, PowerPAD?
Thermally Enhanced Package Application Report
- Texas Instruments, PowerPAD? Made Easy Application Report
- Texas Instruments, Using New Thermal Metrics Application Report
- Texas Instruments, Layout Guidelines for Switching Power Supplies Application
Report
- Texas Instruments, Simple Switcher PCB Layout Guidelines Application
Report
- Texas Instruments, Construction Your Power Supply- Layout Considerations
Seminar
- Texas Instruments, Low Radiated EMI Layout Made Simple with LM4360x and LM4600x
Application Report
- Texas Instruments, AN-2162 Simple Success With Conducted EMI From
DC/DC Converters Application Report
- Texas Instruments, PCB Thermal Calculator
- Texas Instruments, Optimizing Transient Response of Internally
Compensated DC-DC Converters with Feedforward Capacitor Application
Report