ZHCSMU1G October 2020 – May 2024 LMR43610-Q1 , LMR43620-Q1
PRODUCTION DATA
- 1
- 1 特性
- 2 應用
- 3 說明
- 4 Device Comparison Table
- 5 Pin Configuration and Functions
- 6 Specifications
-
7 Detailed Description
- 7.1 Overview
- 7.2 Functional Block Diagram
- 7.3
Feature Description
- 7.3.1 Enable, Start-Up, and Shutdown
- 7.3.2 External CLK SYNC (with MODE/SYNC)
- 7.3.3 Adjustable Switching Frequency (with RT)
- 7.3.4 Power-Good Output Operation
- 7.3.5 Internal LDO, VCC, and VOUT/FB Input
- 7.3.6 Bootstrap Voltage and VBOOT-UVLO (BOOT Terminal)
- 7.3.7 Output Voltage Selection
- 7.3.8 Spread Spectrum
- 7.3.9 Soft Start and Recovery from Dropout
- 7.3.10 Current Limit and Short Circuit
- 7.3.11 Thermal Shutdown
- 7.3.12 Input Supply Current
- 7.4 Device Functional Modes
-
8 Application and Implementation
- 8.1 Application Information
- 8.2
Typical Application
- 8.2.1 Design Requirements
- 8.2.2 Detailed Design Procedure
- 8.2.3 Application Curves
- 8.3 Best Design Practices
- 8.4 Power Supply Recommendations
- 8.5 Layout
- 9 Device and Documentation Support
- 10Revision History
- 11Mechanical, Packaging, and Orderable Information
9.6 靜電放電警告
 |
靜電放電 (ESD) 會損壞這個集成電路。德州儀器 (TI) 建議通過適當的預防措施處理所有集成電路。如果不遵守正確的處理和安裝程序，可能會損壞集成電路。 |
| ESD 的損壞小至導致微小的性能降級，大至整個器件故障。精密的集成電路可能更容易受到損壞，這是因為非常細微的參數更改都可能會導致器件與其發布的規格不相符。 |