ZHCSP81B January 2022 – September 2023 LMR38010
PRODUCTION DATA
| THERMAL METRIC(1) | LMR38010 | UNIT | |
|---|---|---|---|
| DDA (HSOIC) | |||
| 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 42.9 | °C/W |
| RθJA(Effecitve) | Junction-to-ambient thermal resistance with TI EVM board | 29 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 54 | °C/W |
| RθJB | Junction-to-board thermal resistance | 13.6 | °C/W |
| ψJT | Junction-to-top characterization parameter | 4.3 | °C/W |
| ψJB | Junction-to-board characterization parameter | 13.8 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 4.3 | °C/W |