7.4 Thermal Information
The value of RθJA given in this table is only valid for comparison with other packages and can not be used for design purposes. These values were calculated in accordance with JESD 51-7 and simulated on a 4-Layer JEDEC board. They do not represent the performance obtained in an actual application. For design information see Maximum Ambient Temperature section.
| THERMAL METRIC(1)(2) |
LMR34206-Q1 |
UNIT |
| RNX (VQFN-HR) |
| 12 PINS |
| RθJA |
Junction-to-ambient thermal resistance |
72.5 |
°C/W |
| RθJC(top) |
Junction-to-case (top) thermal resistance |
35.9 |
°C/W |
| RθJB |
Junction-to-board thermal resistance |
23.3 |
°C/W |
| ψJT |
Junction-to-top characterization parameter |
0.8 |
°C/W |
| ψJB |
Junction-to-board characterization parameter |
23.5 |
°C/W |
(2) The value of RθJA given in this table is only valid for comparison with other packages and can not be used for design purposes. These values were calculated in accordance with JESD 51-7 and simulated on a 4-Layer JEDEC board. They do not represent the performance obtained in an actual application. For design information see Maximum Ambient Temperature section.