ZHCSG14D October 2015 – October 2017 LMK61A2-100M , LMK61A2-125M , LMK61A2-156M , LMK61A2-312M , LMK61A2-644M , LMK61E0-050M , LMK61E0-155M , LMK61E0-156M , LMK61E2-100M , LMK61E2-125M , LMK61E2-156M , LMK61E2-312M , LMK61I2-100M
PRODUCTION DATA.
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 修訂歷史記錄
- 5 Pin Configuration and Functions
-
6 Specifications
- 6.1 Absolute Maximum Ratings
- 6.2 ESD Ratings
- 6.3 Recommended Operating Conditions
- 6.4 Thermal Information
- 6.5 Electrical Characteristics - Power Supply
- 6.6 LVPECL Output Characteristics
- 6.7 LVDS Output Characteristics
- 6.8 HCSL Output Characteristics
- 6.9 OE Input Characteristics
- 6.10 Frequency Tolerance Characteristics
- 6.11 Power-On/Reset Characteristics (VDD)
- 6.12 PSRR Characteristics
- 6.13 PLL Clock Output Jitter Characteristics
- 6.14 Typical 156.25-MHz Output Phase Noise Characteristics
- 6.15 Additional Reliability and Qualification
- 6.16 Typical Characteristics
- 7 Parameter Measurement Information
- 8 Power Supply Recommendations
- 9 Layout
- 10器件和文檔支持
- 11機械、封裝和可訂購信息
封裝選項
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
機械數(shù)據(jù) (封裝 | 引腳)
- SIA|6
散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)
訂購信息
9.1.2 Best Practices for Signal Integrity
For best electrical performance and signal integrity of entire system with LMK61XX, TI recommends routing vias into decoupling capacitors and then into the LMK61XX. TI also recommends increasing the via count and width of the traces wherever possible. These steps ensure lowest impedance and shortest path for high frequency current flow. Figure 18 shows the layout recommendation for LMK61XX.
Figure 18. LMK61XX Layout Recommendation for Power Supply and Ground