ZHCSH74B december 2017 – august 2023 LMK61E07
PRODUCTION DATA
請(qǐng)參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
Ensured Thermal Reliability, Best Practices for Signal Integrity and Recommended Solder Reflow Profile provide recommendations for board layout, solder reflow profile and power supply bypassing when using LMK61E07 to ensure good thermal and electrical performance and overall signal integrity of entire system.