ZHCSG14D October 2015 – October 2017 LMK61A2-100M , LMK61A2-125M , LMK61A2-156M , LMK61A2-312M , LMK61A2-644M , LMK61E0-050M , LMK61E0-155M , LMK61E0-156M , LMK61E2-100M , LMK61E2-125M , LMK61E2-156M , LMK61E2-312M , LMK61I2-100M
PRODUCTION DATA.
請(qǐng)參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | LMK61XX (2)(3)(4) | UNIT | |||
|---|---|---|---|---|---|
| SIA (QFM) | |||||
| 6 PINS | |||||
| Airflow (LFM) 0 | Airflow (LFM) 200 | Airflow (LFM) 400 | |||
| RθJA | Junction-to-ambient thermal resistance | 55.2 | 46.4 | 43.7 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 34.6 | n/a | n/a | °C/W |
| RθJB | Junction-to-board thermal resistance | 37.7 | n/a | n/a | °C/W |
| ψJT | Junction-to-top characterization parameter | 11.3 | 17.6 | 22.5 | °C/W |
| ψJB | Junction-to-board characterization parameter | 37.7 | 41.5 | 40.1 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | n/a | n/a | °C/W |