ZHCSG14D October 2015 – October 2017 LMK61A2-100M , LMK61A2-125M , LMK61A2-156M , LMK61A2-312M , LMK61A2-644M , LMK61E0-050M , LMK61E0-155M , LMK61E0-156M , LMK61E2-100M , LMK61E2-125M , LMK61E2-156M , LMK61E2-312M , LMK61I2-100M
PRODUCTION DATA.
- 1 特性
- 2 應(yīng)用
- 3 說(shuō)明
- 4 修訂歷史記錄
- 5 Pin Configuration and Functions
-
6 Specifications
- 6.1 Absolute Maximum Ratings
- 6.2 ESD Ratings
- 6.3 Recommended Operating Conditions
- 6.4 Thermal Information
- 6.5 Electrical Characteristics - Power Supply
- 6.6 LVPECL Output Characteristics
- 6.7 LVDS Output Characteristics
- 6.8 HCSL Output Characteristics
- 6.9 OE Input Characteristics
- 6.10 Frequency Tolerance Characteristics
- 6.11 Power-On/Reset Characteristics (VDD)
- 6.12 PSRR Characteristics
- 6.13 PLL Clock Output Jitter Characteristics
- 6.14 Typical 156.25-MHz Output Phase Noise Characteristics
- 6.15 Additional Reliability and Qualification
- 6.16 Typical Characteristics
- 7 Parameter Measurement Information
- 8 Power Supply Recommendations
- 9 Layout
- 10器件和文檔支持
- 11機(jī)械、封裝和可訂購(gòu)信息
封裝選項(xiàng)
請(qǐng)參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- SIA|6
散熱焊盤(pán)機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購(gòu)信息
7.1 Device Output Configurations
Figure 10. LVPECL Output DC Configuration During Device Test
Figure 11. LVDS Output DC Configuration During Device Test
Figure 12. HCSL Output DC Configuration During Device Test
Figure 13. LVPECL Output AC Configuration During Device Test
Figure 14. LVDS Output AC Configuration During Device Test
Figure 15. HCSL Output AC Configuration During Device Test
Figure 16. PSRR Test Setup
Figure 17. Differential Output Voltage and Rise/Fall Time