ZHCSLT3B december 2020 – june 2023 LMK1D1204 , LMK1D1208
PRODUCTION DATA
For reliability and performance reasons, the die temperature must be limited to a maximum of 135°C.
The device package has an exposed pad that provides the primary heat removal path to the printed circuit board (PCB). To maximize the heat dissipation from the package, a thermal landing pattern including multiple vias to a ground plane must be incorporated into the PCB within the footprint of the package. The thermal pad must be soldered down to ensure adequate heat conduction to of the package. Figure 10-6 shows a recommended land and via pattern for LMK1D1208.