ZHCSHN8B February 2018 – October 2018 LMG1020
PRODUCTION DATA.
| THERMAL METRIC(1) | SN1020 | UNIT | |
|---|---|---|---|
| YFF (WCSP) | |||
| 6 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 133.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 1.7 | °C/W |
| RθJB | Junction-to-board thermal resistance | 38.1 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 0.5 | °C/W |
| YJB | Junction-to-board characterization parameter | 38.3 | °C/W |