| ESD Tolerance(3) | 2KV |
| Differential Input Voltage | (V+)+0.3V to (V?)?0.3V |
| Voltage at Input/Output Pin | (V+)+0.3V to (V?)?0.3V |
| Supply Voltage (V+–V?) | 16V |
| Current at Input Pin | ±5mA |
| Current at Output Pin(5)(4) ? | ±30mA |
| Current at Power Supply Pin, LMC6762? | 40mA |
| Lead Temperature (Soldering, 10 seconds)? | 260°C |
| Storage Temperature Range | ?65°C to +150°C |
| Junction Temperature(6) | 150°C |
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the electrical characteristics.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(3) Human body model, 1.5kΩ in series with 100pF.
(4) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of ±30 mA over long term may adversely affect reliability.
(5) Do not short circuit output to V+, when V+ is greater than 12V or reliability will be adversely affected.
(6) The maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(max) – TA)/θJA.All numbers apply for packages soldered directly into a PC board.