ZHCSK76 September 2019 LM74202-Q1
PRODUCTION DATA.
| THERMAL METRIC(1) | LM74202-Q1 | UNIT | |
|---|---|---|---|
| PWP (HTSSOP) | |||
| 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 38.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 22.7 | °C/W |
| RθJB | Junction-to-board thermal resistance | 18.2 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 0.5 | °C/W |
| YJB | Junction-to-board characterization parameter | 18 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 1.5 | °C/W |