ZHCSKD6A October 2019 – April 2024 LM5163
PRODUCTION DATA
- 1
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 Pin Configuration and Functions
- 5 Specifications
-
6 Detailed Description
- 6.1 Overview
- 6.2 Functional Block Diagram
- 6.3
Feature Description
- 6.3.1 Control Architecture
- 6.3.2 Internal VCC Regulator and Bootstrap Capacitor
- 6.3.3 Regulation Comparator
- 6.3.4 Internal Soft Start
- 6.3.5 On-Time Generator
- 6.3.6 Current Limit
- 6.3.7 N-Channel Buck Switch and Driver
- 6.3.8 Synchronous Rectifier
- 6.3.9 Enable/Undervoltage Lockout (EN/UVLO)
- 6.3.10 Power Good (PGOOD)
- 6.3.11 Thermal Protection
- 6.4 Device Functional Modes
- 7 Application and Implementation
- 8 Device and Documentation Support
- 9 Revision History
- 10Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- DDA|8
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
- DDA|8
訂購(gòu)信息
8.6 靜電放電警告
 |
靜電放電 (ESD) 會(huì)損壞這個(gè)集成電路。德州儀器 (TI) 建議通過適當(dāng)?shù)念A(yù)防措施處理所有集成電路。如果不遵守正確的處理和安裝程序，可能會(huì)損壞集成電路。 |
| ESD 的損壞小至導(dǎo)致微小的性能降級(jí)，大至整個(gè)器件故障。精密的集成電路可能更容易受到損壞，這是因?yàn)榉浅＜?xì)微的參數(shù)更改都可能會(huì)導(dǎo)致器件與其發(fā)布的規(guī)格不相符。 |