ZHCSEL1C May 2012 – Februrary 2016 LM5134
PRODUCTION DATA.
- 1 特性
- 2 應用
- 3 說明
- 4 修訂歷史記錄
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Detailed Description
- 8 Application and Implementation
- 9 Power Supply Recommendations
- 10Layout
- 11器件和文檔支持
- 12機械、封裝和可訂購信息
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| Pin voltage | VDD to VSS | −0.3 | 14 | V |
| IN, INB to VSS | −0.3 | 14 | ||
| Junction temperature, TJ | 150 | °C | ||
| Storage temperature, Tstg | −55 | 150 | °C | |
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
| VALUE | UNIT | |||
|---|---|---|---|---|
| V(ESD) | Electrostatic discharge | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | ±2000 | V |
| Charged-device model (CDM), per JEDEC specification JESD22-C101(2) | ±1000 | |||
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)| MIN | NOM | MAX | UNIT | |
|---|---|---|---|---|
| Gate drive supply, VDD | 4 | 12.6 | V | |
| Operating junction temperature | –40 | 125 | °C |
6.4 Thermal Information
| THERMAL METRIC(1) | LM5134 | UNIT | ||
|---|---|---|---|---|
| DBV (SOT-23) | NGG (WSON) | |||
| 6 PINS | 6 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 105.9 | 51 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 52.1 | 47 | °C/W |
| RθJB | Junction-to-board thermal resistance | 21 | 25.3 | °C/W |
| ψJT | Junction-to-top characterization parameter | 1.2 | 0.6 | °C/W |
| ψJB | Junction-to-board characterization parameter | 20.5 | 24.5 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | 5.8 | °C/W |
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
6.5 Electrical Characteristics
TJ = 25°C, VDD = 12 V, unless otherwise specified. Minimum and Maximum limits are ensured through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only.(1).| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | ||
|---|---|---|---|---|---|---|---|
| POWER SUPPLY | |||||||
| VDD | VDD operating voltage | TJ = –40°C to +125°C | 4 | 12.6 | V | ||
| UVLO | VDD undervoltage lockout | VDD rising | TJ = 25°C | 3.6 | V | ||
| TJ = –40°C to +125°C | 3.25 | 4 | |||||
| VDD undervoltage lockout hysteresis | 0.36 | V | |||||
| VDD undervoltage lockout to main output delay time | VDD rising | 500 | ns | ||||
| IDD | VDD quiescent current | IN = INB = VDD | TJ = 25°C | 0.8 | mA | ||
| TJ = –40°C to +125°C | 2 | ||||||
| OUTPUT | |||||||
| RON-DW (SOT23-6) | Main output resistance – pulling down | VDD = 10 V, IOUT = –100 mA | TJ = 25°C | 0.15 | Ω | ||
| TJ = –40°C to +125°C | 0.45 | ||||||
| VDD = 4.5 V, IOUT = –100 mA | TJ = 25°C | 0.2 | Ω | ||||
| TJ = –40°C to +125°C | 0.5 | ||||||
| RON-DW (WSON) | Main output resistance – pulling down | VDD = 10 V, IOUT = –100 mA | TJ = 25°C | 0.2 | Ω | ||
| TJ = –40°C to +125°C | 0.5 | ||||||
| VDD = 4.5 V, IOUT = –100 mA | TJ = 25°C | 0.25 | Ω | ||||
| TJ = –40°C to +125°C | 0.55 | ||||||
| Power-off pulldown resistance | VDD = 0 V, IOUT = –10 mA | 1.5 | 10 | Ω | |||
| Power-off pulldown clamp voltage | VDD = 0 V, IOUT = –10 mA | 0.7 | 1 | V | |||
| Peak sink current | CL = 10,000 pF | 7.6 | A | ||||
| RON-UP (SOT23-6) | Main output resistance - pulling up | VDD = 10 V, IOUT = 50 mA |
TJ = 25°C | 0.7 | Ω | ||
| TJ = –40°C to +125°C | 1.3 | ||||||
| VDD = 4.5 V, IOUT = 50 mA |
TJ = 25°C | 1 | Ω | ||||
| TJ = –40°C to +125°C | 1.9 | ||||||
| RON-UP (WSON) | Main output resistance - pulling up | VDD = 10 V, IOUT = 50 mA |
TJ = 25°C | 0.75 | Ω | ||
| TJ = –40°C to +125°C | 1.2 | ||||||
| VDD = 4.5 V, IOUT = 50 mA |
TJ = 25°C | 1.14 | Ω | ||||
| TJ = –40°C to +125°C | 1.85 | ||||||
| Peak source current | CL = 10,000 pF | 4.5 | A | ||||
| PILOT | |||||||
| RONP-DW | PILOT output resistance – pulling down | VDD = 10 V, IOUT = –100 mA |
TJ = 25°C | 3.7 | Ω | ||
| TJ = –40°C to +125°C | 9 | ||||||
| VDD = 4.5 V, IOUT = –100 mA |
TJ = 25°C | 4.7 | Ω | ||||
| TJ = –40°C to +125°C | 12 | ||||||
| Peak sink current | CL = 330 pF | 820 | mA | ||||
| RONP-UP | PILOT output resistance – pulling up | VDD = 10 V, IOUT = 50 mA |
TJ = 25°C | 6 | Ω | ||
| TJ = –40°C to +125°C | 11 | ||||||
| VDD = 4.5 V, IOUT = 50 mA |
TJ = 25°C | 10.7 | Ω | ||||
| TJ = –40°C to +125°C | 20 | ||||||
| Peak source current | CL = 330 pF | 660 | mA | ||||
| LOGIC INPUT | |||||||
| VIH | Logic 1 input voltage | LM5134A, TJ = –40°C to +125°C | 0.67 × VDD | V | |||
| LM5134B, TJ = –40°C to +125°C | 2.4 | ||||||
| VIL | Logic 0 input voltage | LM5134A, TJ = –40°C to +125°C | 0.33 × VDD | V | |||
| LM5134B, TJ = –40°C to +125°C | 0.8 | ||||||
| VHYS | Logic-input hysteresis | LM5134A | 0.9 | V | |||
| LM5134B | 0.68 | ||||||
| Logic-input current | INB = VDD or 0 | TJ = 25°C | 0.001 | µA | |||
| TJ = –40°C to +125°C | 10 | ||||||
| THERMAL RESISTANCE | |||||||
| θJA | Junction to ambient | SOT23-6 | 90 | °C/W | |||
| WSON-6 | 60 | °C/W | |||||
(1) Min and Max limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlation using Statistical Quality Control (SQC) methods. Limits are used to calculate Average Outgoing Quality Level (AOQL).
6.6 Switching Characteristics
over operating free-air temperature range (unless otherwise noted)| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | ||
|---|---|---|---|---|---|---|---|
| FOR VDD = +10 V | |||||||
| tR | OUT rise time | CL = 1000 pF | 3 | ns | |||
| CL = 5000 pF | 10 | ||||||
| CL = 10,000 pF | 20 | ||||||
| tF | OUT fall time | CL = 1000 pF | 2 | ns | |||
| CL = 5000 pF | 4.7 | ||||||
| CL = 10,000 pF | 7.2 | ||||||
| tD-ON | OUT turnon propagation delay | CL = 1000 pF | TJ = 25°C | 17 | ns | ||
| TJ = –40°C to +125°C | 40 | ||||||
| tD-OFF | OUT turnoff propagation delay | CL = 1000 pF | TJ = 25°C | 12 | ns | ||
| TJ = –40°C to +125°C | 25 | ||||||
| Main output break-before-make time | 2.5 | ns | |||||
| tPR | PILOT rise time | CL = 330 pF | 5.3 | ns | |||
| tPF | PILOT fall time | CL = 330 pF | 3.9 | ns | |||
| tPD-ON | OUT turnoff to PILOT turnon propagation delay | CL = 330 pF | 4.2 | ns | |||
| tPD-OFF | PILOT turnoff to OUT turnon propagation delay | CL = 330 pF | 6.4 | ns | |||
| FOR VDD = +4.5 V | |||||||
| tR | Rise time | CL = 1000 pF | 5 | ns | |||
| CL = 5000 pF | 14 | ||||||
| CL = 10,000 pF | 24 | ||||||
| tF | Fall time | CL = 1000 pF | 2.3 | ns | |||
| CL = 5000 pF | 5.4 | ||||||
| CL = 10,00 0pF | 7.2 | ||||||
| tD-ON | OUT turnon propagation delay | CL = 1000 pF | TJ = 25°C | 26 | ns | ||
| TJ = –40°C to +125°C | 50 | ||||||
| tD-OFF | OUT turnoff propagation delay | CL = 1000 pF | TJ = 25°C | 20 | ns | ||
| TJ = –40°C to +125°C | 45 | ||||||
| Main output break-before-make time | 4.2 | ns | |||||
| tPR | PILOT rise time | CL = 330 pF | 9.6 | ns | |||
| tPf | PILOT fall time | CL = 330 pF | 3.7 | ns | |||
| tPD-ON | OUT turnoff to PILOT turnon propagation delay | CL = 330 pF | 7.5 | ns | |||
| tPD-OFF | PILOT turnoff to OUT turnon propagation delay | CL = 330 pF | 11.8 | ns | |||
Figure 1. Timing Diagram — Noninverting Input
Figure 2. Timing Diagram — Inverting Input
6.7 Typical Characteristics
Figure 3. OUT Source Current vs OUT Voltage
Figure 5. OUT Peak Source Current vs VDD Voltage
Figure 7. PILOT Source Current vs PILOT Voltage
Figure 9. PILOT Peak Source Current vs VDD Voltage
Figure 11. OUT Turnon Propagation Delay vs VDD
Figure 13. OUT Turnoff to PILOT Turnon Propagation Delay vs VDD
Figure 15. Supply Current vs OUT Capacitive Load
Figure 17. Supply Current vs Frequency
Figure 19. LM5134A Input Threshold vs Temperature
Figure 21. LM5134B Input Threshold vs Temperature
Figure 23. UVLO Threshold vs Temperature
Figure 4. OUT Sink Current vs OUT Voltage
Figure 6. OUT Peak Sink Current vs VDD Voltage
Figure 8. PILOT Sink Current vs PILOT Voltage
Figure 10. PILOT Peak Sink Current vs VDD Voltage
Figure 12. OUT Turnoff Propagation Delay vs VDD
Figure 14. PILOT Turnoff to OUT Turnon Propagation Delay vs VDD
Figure 16. Supply Current vs PILOT Capacitive Load
Figure 18. Quiescent Current vs Temperature
Figure 20. LM5134A Input Threshold vs Temperature
Figure 22. LM5134B Input Threshold vs Temperature