ZHCSG45B March 2017 – March 2018 LM5113-Q1
PRODUCTION DATA.
5 Pin Configuration and Functions
DPR Package
10-Pin WSON With Exposed Thermal Pad
Top View
Pin Functions
| PIN | TYPE (1) | DESCRIPTION | |||
|---|---|---|---|---|---|
| NO. | NAME | ||||
| 1 | VDD | P | 5-V positive gate drive supply: locally decouple to VSS using low-ESR/ESL capacitor located as close as possible to the IC. | ||
| 2 | HB | P | High-side gate driver bootstrap rail: connect the positive terminal of the bootstrap capacitor to HB and the negative terminal to HS. The bootstrap capacitor must be placed as close to the IC as possible. | ||
| 3 | HOH | O | High-side gate driver turnon output: connect to the gate of high-side GaN FET with a short, low inductance path. A gate resistor can be used to adjust the turnon speed. | ||
| 4 | HOL | O | High-side gate driver turnoff output: connect to the gate of high-side GaN FET with a short, low inductance path. A gate resistor can be used to adjust the turnoff speed. | ||
| 5 | HS | P | High-side GaN FET source connection: connect to the bootstrap capacitor negative terminal and the source of the high-side GaN FET. | ||
| 6 | HI | I | High-side driver control input. The LM5113-Q1 inputs have TTL type thresholds. Unused inputs must be tied to ground and not left open. | ||
| 7 | LI | I | Low-side driver control input. The LM5113-Q1 inputs have TTL type thresholds. Unused inputs must be tied to ground and not left open. | ||
| 8 | VSS | G | Ground return: all signals are referenced to this ground. | ||
| 9 | LOL | O | Low-side gate driver sink-current output: connect to the gate of the low-side GaN FET with a short, low inductance path. A gate resistor can be used to adjust the turnoff speed. | ||
| 10 | LOH | O | Low-side gate driver source-current output: connect to the gate of high-side GaN FET with a short, low inductance path. A gate resistor can be used to adjust the turnon speed. | ||
| EP | — | — | Exposed pad: TI recommends that the exposed pad on the bottom of the package be soldered to ground plane on the printed-circuit board to aid thermal dissipation. | ||
(1) I = Input, O = Output, G = Ground, P = Power