ZHCSM35F January 2007 – May 2021 LM5002
PRODUCTION DATA
| THERMAL METRIC(1) | LM5002 | UNIT | ||
|---|---|---|---|---|
| D (SOIC) | NGT (WSON) | |||
| 8 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 105.7 | 37.1 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 50.8 | 25.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 46.1 | 14.2 | °C/W |
| ψJT | Junction-to-top characterization parameter | 8.2 | 0.2 | °C/W |
| ψJB | Junction-to-board characterization parameter | 45.6 | 14.4 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | 3.8 | °C/W |