ZHCSIA9M May 2003 – December 2024 LM2903-Q1 , LM2903B-Q1
PRODUCTION DATA
請參考 PDF 數據表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | LM2903x-Q1 | UNIT | |||||
|---|---|---|---|---|---|---|---|
| D (SOIC) | DGK (VSSOP) | PW (TSSOP) | DSG (WSON) | DDF (SOT-23) | |||
| 8 PINS | 8 PINS | 8 PINS | 8 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 154.1 | 176.5 | 182.9 |
102.1 | 197.9 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 96.5 | 85.5 | 87.1 |
126.0 | 119.2 | |
| RθJB | Junction-to-board thermal resistance | 97.7 | 112.4 | 123.2 |
68.6 | 115.4 | |
| ψJT | Junction-to-top characterization parameter | 45.7 | 17.3 | 16.7 |
15.9 | 19.4 | |
| ψJB | Junction-to-board characterization parameter | 96.9 | 110.1 | 120.4 |
68.4 | 113.7 | |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | - | - | - |
43.9 | - | |