ZHCSNW6H December 2003 – June 2025 LM2901-Q1 , LM2901AV-Q1 , LM2901B-Q1 , LM2901V-Q1
PRODUCTION DATA
請參考 PDF 數據表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | All Devices | UNIT | |||||
|---|---|---|---|---|---|---|---|
| D (SOIC) |
PW (TSSOP) |
DDY (SOT-23) |
RTE (WQFN) |
RUC (X2QFN) |
|||
| 14 PINS | 14 PINS | 14 PINS | 16 PINS | 14 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 111.2 | 136.6 | 67.6 | °C/W | ||
| RθJC(top) | Junction-to-case (top) thermal resistance | 66.9 | 66.6 | 72.3 | |||
| RθJB | Junction-to-board thermal resistance | 67.8 | 79.8 | 43.1 | |||
| ψJT | Junction-to-top characterization parameter | 28.0 | 17.8 | 6.3 | |||
| ψJB | Junction-to-board characterization parameter | 67.4 | 79.3 | 42.8 | |||
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | - | - | - | 26.4 | - | |