ZHCSIR1C June 2018 – May 2021 LM2775-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | LM2775-Q1 | UNIT | |
|---|---|---|---|
| DSG (WSON) | |||
| 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 71.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 95.0 | °C/W |
| RθJB | Junction-to-board thermal resistance | 41.5 | °C/W |
| ψJT | Junction-to-top characterization parameter | 3.2 | °C/W |
| ψJB | Junction-to-board characterization parameter | 41.8 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 12.8 | °C/W |