ZHCSBF2B August 2013 – November 2014 LM27403
PRODUCTION DATA.
- 1 特性
- 2 應用范圍
- 3 說明
- 4 修訂歷史記錄
- 5 說明 （續）
- 6 Pin Configuration and Functions
- 7 Specifications
-
8 Detailed Description
- 8.1 Overview
- 8.2 Functional Block Diagram
- 8.3
Feature Description
- 8.3.1 Input Range: VIN
- 8.3.2 Output Voltage: FB Voltage and Accuracy
- 8.3.3 Input and Bias Rail Voltages: VIN and VDD
- 8.3.4 Precision Enable: UVLO/EN
- 8.3.5 Switching Frequency
- 8.3.6 Temperature Sensing: D+ and D-
- 8.3.7 Thermal Shutdown: OTP
- 8.3.8 Inductor-DCR-Based Overcurrent Protection
- 8.3.9 Current Sensing: CS+ and CS-
- 8.3.10 Current Limit Handling
- 8.3.11 Soft-Start: SS/TRACK
- 8.3.12 Monotonic Startup
- 8.3.13 Prebias Startup
- 8.3.14 Voltage-Mode Control
- 8.3.15 Output Voltage Remote Sense: RS
- 8.3.16 Power Good: PGOOD
- 8.3.17 Gate Drivers: LG and HG
- 8.3.18 Sink and Source Capability
- 8.4 Device Functional Modes
-
9 Application and Implementation
- 9.1 Application Information
- 9.2
Typical Applications
- 9.2.1 Design 1 - High-Efficiency Synchronous Buck Regulator for Telecom Power
- 9.2.2 Design 2 - Powering FPGAs Using Flexible 30A Regulator With Small Footprint
- 9.2.3 Design 3 - Powering Multicore DSPs
- 9.2.4 Design 4 - Regulated 12-V Rail with LDO Low-Noise Auxiliary Output for RF Power
- 9.2.5 Design 5 - High Power Density Implementation From 3.3-V or 5-V Supply Rail
- 10Power Supply Recommendations
- 11Layout
- 12器件和文檔支持
- 13機械、封裝和可訂購信息
12 器件和文檔支持
12.1 器件支持
12.1.1 開發支持
- TI NexFET™ 電源塊模塊 CSD87330Q3D
- LM27403 設計工具
- PowerLab™
12.1.2 第三方產品免責聲明
TI 發布的與第三方產品或服務有關的信息，不能構成與此類產品或服務或保修的適用性有關的認可，不能構成此類產品或服務單獨或與任何 TI 產品或服務一起的表示或認可。
12.2 文檔支持
12.3 商標
PowerPAD, and Power Block NexFET are trademarks of Texas Instruments.
WEBENCH is a registered trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 靜電放電警告
這些裝置包含有限的內置 ESD 保護。 存儲或裝卸時，應將導線一起截短或將裝置放置于導電泡棉中，以防止 MOS 門極遭受靜電損傷。