ZHCSNR6G June 1999 – March 2023 LM2576 , LM2576HV
PRODUCTION DATA
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 Revision History
- 5 Pin Configuration and Functions
-
6 Specifications
- 6.1 Absolute Maximum Ratings
- 6.2 ESD Ratings
- 6.3 Recommended Operating Conditions
- 6.4 Thermal Information
- 6.5 Electrical Characteristics: 3.3 V
- 6.6 Electrical Characteristics: 5 V
- 6.7 Electrical Characteristics: 12 V
- 6.8 Electrical Characteristics: 15 V
- 6.9 Electrical Characteristics: Adjustable Output Voltage
- 6.10 Electrical Characteristics: All Output Voltage Versions
- 6.11 Typical Characteristics
- 7 Detailed Description
- 8 Application and Implementation
- 9 Device and Documentation Support
- 10Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- NDH|5
- NEB|5
- KTT|5
- KC|5
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
- KTT|5
訂購信息
6.11 Typical Characteristics
(Circuit of Figure 8-3 and Figure 8-9)
If the DDPAK/TO-263 package is used, the thermal resistance can be reduced by increasing the PCB copper area thermally connected to the package. Using 0.5 square inches of copper area, θJA is 50°C/W, with 1 square inch of copper area, θJA is 37°C/W, and with 1.6 or more square inches of copper area, θJA is 32°C/W.
Figure 6-17 Maximum Power Dissipation (DDPAK/TO-263)
VOUT = 15 V A: Output Pin Voltage, 50 V/div B: Output Pin Current, 2 A/div C: Inductor Current, 2 A/div D: Output Ripple Voltage, 50 mV/div, AC-CoupledHorizontal Time Base: 5 μs/div
Figure 6-18 Switching Waveforms