ZHCSIM4H April 2009 – November 2014 LM25011 , LM25011-Q1
PRODUCTION DATA.
| THERMAL METRIC(1) | HVSSOP (DGQ) | UNIT | ||
|---|---|---|---|---|
| 10 PINS | ||||
| RθJA | Junction-to-ambient thermal resistance | 48 | °C/W | |
| RθJC(top) | Junction-to-case (top) thermal resistance | 54.3 | ||
| RθJB | Junction-to-board thermal resistance | 34.2 | ||
| ψJT | Junction-to-top characterization parameter | 4.0 | ||
| ψJB | Junction-to-board characterization parameter | 33.9 | ||
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 10 | ||