ZHCSHX3A December 2014 – March 2018 LDC1312 , LDC1314
PRODUCTION DATA.
- 1 特性
- 2 應用
- 3 說明
- 4 修訂歷史記錄
- 5 Pin Configuration and Functions
- 6 Specifications
-
7 Detailed Description
- 7.1 Overview
- 7.2 Functional Block Diagram
- 7.3 Feature Description
- 7.4 Device Functional Modes
- 7.5 Programming
- 7.6
Register Maps
- 7.6.1 Register List
- 7.6.2 Address 0x00, DATA0
- 7.6.3 Address 0x02, DATA1
- 7.6.4 Address 0x04, DATA2 (LDC1314 only)
- 7.6.5 Address 0x06, DATA3 (LDC1314 only)
- 7.6.6 Address 0x08, RCOUNT0
- 7.6.7 Address 0x09, RCOUNT1
- 7.6.8 Address 0x0A, RCOUNT2 (LDC1314 only)
- 7.6.9 Address 0x0B, RCOUNT3 (LDC1314 only)
- 7.6.10 Address 0x0C, OFFSET0
- 7.6.11 Address 0x0D, OFFSET1
- 7.6.12 Address 0x0E, OFFSET2 (LDC1314 only)
- 7.6.13 Address 0x0F, OFFSET3 (LDC1314 only)
- 7.6.14 Address 0x10, SETTLECOUNT0
- 7.6.15 Address 0x11, SETTLECOUNT1
- 7.6.16 Address 0x12, SETTLECOUNT2 (LDC1314 only)
- 7.6.17 Address 0x13, SETTLECOUNT3 (LDC1314 only)
- 7.6.18 Address 0x14, CLOCK_DIVIDERS0
- 7.6.19 Address 0x15, CLOCK_DIVIDERS1
- 7.6.20 Address 0x16, CLOCK_DIVIDERS2 (LDC1314 only)
- 7.6.21 Address 0x17, CLOCK_DIVIDERS3 (LDC1314 only)
- 7.6.22 Address 0x18, STATUS
- 7.6.23 Address 0x19, ERROR_CONFIG
- 7.6.24 Address 0x1A, CONFIG
- 7.6.25 Address 0x1B, MUX_CONFIG
- 7.6.26 Address 0x1C, RESET_DEV
- 7.6.27 Address 0x1E, DRIVE_CURRENT0
- 7.6.28 Address 0x1F, DRIVE_CURRENT1
- 7.6.29 Address 0x20, DRIVE_CURRENT2 (LDC1314 only)
- 7.6.30 Address 0x21, DRIVE_CURRENT3 (LDC1314 only)
- 7.6.31 Address 0x7E, MANUFACTURER_ID
- 7.6.32 Address 0x7F, DEVICE_ID
-
8 Application and Implementation
- 8.1
Application Information
- 8.1.1 Conductive Objects in a Time-Varying EM Field
- 8.1.2 L-C Resonators
- 8.1.3 Multi-Channel and Single Channel Operation
- 8.1.4 Sensor Conversion Time
- 8.1.5 Sensor Current Drive Configuration
- 8.1.6 Clocking Architecture
- 8.1.7 Input Deglitch Filter
- 8.1.8 Device Status Registers
- 8.1.9 Multi-Channel Data Readback
- 8.2 Typical Application
- 8.1
Application Information
- 9 Power Supply Recommendations
- 10Layout
- 11器件和文檔支持
- 12機械、封裝和可訂購信息
封裝選項
機械數(shù)據(jù) (封裝 | 引腳)
- RGH|16
散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)
- RGH|16
訂購信息
8.2.6 Application Curves
Common Test Conditions (unless specified otherwise):
- Sensor inductor: 2 layer, 32 turns/layer, 14mm diameter, PCB inductor with L=19.4 µH, RP=5.7 kΩ at 2 MHz
- Sensor capacitor: 330 pF 1% COG/NP0
- Target: Aluminum, 1.5 mm thickness
- Channel = Channel 0 (continuous mode)
- ƒCLKIN = 40 MHz, FIN_DIVIDERx = 0x01, FREF_DIVIDERx = 0x001
- RCOUNT0 = 0xFFFF, SETTLECOUNT0 = 0x0100
- RP_OVERRIDE = 1, AUTO_AMP_DIS = 1, DRIVE_CURRENT0 = 0x9800
Figure 57. Typical Output Code vs. Target Distance (0 to 14mm)
Figure 58. Measurement Precision in Distance vs. Target Distance (0 to 10mm)