ZHCSKG9 November 2019 LDC1001-Q1
PRODUCTION DATA.
| THERMAL METRIC(1) | LDC1001-Q1 | UNIT | |
|---|---|---|---|
| PW (TSSOP) | |||
| 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 106.3 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 40.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 51.3 | °C/W |
| ψJT | Junction-to-top characterization parameter | 3.6 | °C/W |
| ψJB | Junction-to-board characterization parameter | 50.8 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | °C/W |