ZHCSET4B December 2015 – April 2024 LDC0851
PRODUCTION DATA
| THERMAL METRIC(1) | LDC0851 | UNIT | ||
|---|---|---|---|---|
| DSG (WSON) | ||||
| 8 PINS | ||||
| RθJA | Junction-to-ambient thermal resistance | 67.4 | °C/W | |
| RθJC(top) | Junction-to-case (top) thermal resistance | 89.3 | °C/W | |
| RθJB | Junction-to-board thermal resistance | 37.3 | °C/W | |
| ψJT | Junction-to-top characterization parameter | 2.4 | °C/W | |
| ψJB | Junction-to-board characterization parameter | 37.7 | °C/W | |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 9.2 | °C/W | |