ZHCSET4B December 2015 – April 2024 LDC0851
PRODUCTION DATA
- 1
- 1 特性
- 2 應用
- 3 說明
- 4 Pin Configuration and Functions
- 5 Specifications
- 6 Detailed Description
- 7 Application and Implementation
- 8 Device and Documentation Support
- 9 Revision History
- 10Mechanical, Packaging, and Orderable Information
4 Pin Configuration and Functions
Figure 4-1 DSG Package8-Pin WSON with DAPTop ViewTable 4-1 Pin Functions
| PIN | TYPE(1) | DESCRIPTION | |
|---|---|---|---|
| NAME | NO. | ||
| LCOM | 1 | A | Common coil input |
| LSENSE | 2 | A | Sense coil input |
| LREF | 3 | A | Reference coil input |
| ADJ | 4 | A | Threshold adjust pin |
| OUT | 5 | O | Switch output |
| EN | 6 | I | Enable input |
| GND | 7 | G | Ground |
| VDD | 8 | P | Power Supply |
| DAP | DAP | G | Connect to Ground for improved thermal performance(2) |
(1) I = Input, O = Output, P = Power, A = Analog, G =
Ground
(2) There is an internal electrical connection between the
exposed Die Attach Pad (DAP) and the GND pin of the device. Although the DAP can
be left floating, for best performance the DAP should be connected to the same
potential as the device's GND pin. Do not use the DAP as the primary ground for
the device. The device GND pin must always be connected to ground.