ZHCSDD6I November 2014 – November 2024 ISO7841
PRODUCTION DATA
請參考 PDF 數據表獲取器件具體的封裝圖。
| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
|---|---|---|---|---|---|---|
| IS | Safety input, output, or supply current | RθJA = 78.9°C/W, VI = 5.5V, TJ = 150°C, TA = 25°C | 288 | mA | ||
| RθJA = 78.9°C/W, VI = 3.6V, TJ = 150°C, TA = 25°C | 440 | |||||
| RθJA = 78.9°C/W, VI = 2.75V, TJ = 150°C, TA = 25°C | 576 | |||||
| PS | Safety input, output, or total power | RθJA = 78.9°C/W, TJ = 150°C, TA = 25°C | 1584 | mW | ||
| TS | Maximum safety temperature | 150 | °C | |||
The maximum safety temperature is the maximum junction temperature specified for the device. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the Section 5.4 is that of a device installed on a high-K test board for leaded surface-mount packages. The power is the recommended maximum input voltage times the current. The junction temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance.