ZHCSDD6I November 2014 – November 2024 ISO7841
PRODUCTION DATA
請參考 PDF 數據表獲取器件具體的封裝圖。
| ISO7841 | UNIT | ||||
|---|---|---|---|---|---|
| THERMAL METRIC(1) | DW (SOIC) | DWW (SOIC) | |||
| 16 Pins | 16 Pins | ||||
| RθJA | Junction-to-ambient thermal resistance | 78.9 | 78.9 | °C/W | |
| RθJC(top) | Junction-to-case(top) thermal resistance | 41.6 | 41.1 | °C/W | |
| RθJB | Junction-to-board thermal resistance | 43.6 | 49.5 | °C/W | |
| ψJT | Junction-to-top characterization parameter | 15.5 | 15.2 | °C/W | |
| ψJB | Junction-to-board characterization parameter | 43.1 | 48.8 | °C/W | |
| RθJC(bottom) | Junction-to-case(bottom) thermal resistance | N/A | N/A | °C/W | |