ZHCSGK0H August 2017 – January 2024 ISO7760 , ISO7761 , ISO7762 , ISO7763
PRODUCTION DATA
| THERMAL METRIC (1) | ISO776x | UNIT | ||
|---|---|---|---|---|
| DW (SOIC) | DBQ (SSOP) | |||
| 16 PINS | 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 60.3 | 86.5 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 24.0 | 26.9 | °C/W |
| RθJB | Junction-to-board thermal resistance | 29.3 | 36.6 | °C/W |
| ψJT | Junction-to-top characterization parameter | 3.3 | 1.7 | °C/W |
| ψJB | Junction-to-board characterization parameter | 28.7 | 36.1 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | n/a | °C/W |