ZHCSF48J March 2016 – October 2024 ISO7740 , ISO7741 , ISO7742
PRODUCTION DATA
| THERMAL METRIC(1) | ISO774x | UNIT | ||
|---|---|---|---|---|
| DW (SOIC) | DBQ (QSOP) | |||
| 16 PINS | 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 83.4 | 109 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 46 | 54.4 | °C/W |
| RθJB | Junction-to-board thermal resistance | 48 | 51.9 | °C/W |
| ψJT | Junction-to-top characterization parameter | 19.1 | 14.2 | °C/W |
| ψJB | Junction-to-board characterization parameter | 47.5 | 51.4 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | — | °C/W |