ZHCSDT1D june 2015 – may 2023 ISO5451
PRODUCTION DATA
請(qǐng)參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | ||
|---|---|---|---|---|---|---|---|
| IS | Safety input, output or supply current | RθJA = 99.6°C/W, VI = 3.6 V, TJ = 150°C, TA = 25°C | 349 | mA | |||
| RθJA = 99.6°C/W, VI = 5.5 V, TJ = 150°C, TA = 25°C | 228 | ||||||
| RθJA = 99.6°C/W, VI = 15 V, TJ = 150°C, TA = 25°C | 84 | ||||||
| RθJA = 99.6°C/W, VI = 30 V, TJ = 150°C, TA = 25°C | 42 | ||||||
| PS | Safety input, output, or total power | RθJA = 99.6°C/W, TJ = 150°C, TA = 25°C | 1255(1) | mW | |||
| TS | Maximum ambient safety temperature | 150 | °C | ||||
The safety-limiting constraint is the maximum junction temperature specified in the data sheet. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the Section 7.4 table is that of a device installed on a high-K test board for leaded surface-mount packages. The power is the recommended maximum input voltage times the current. The junction temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance.