ZHCSIE0A June 2018 – October 2018 ISO224
PRODUCTION DATA.
| THERMAL METRIC (1) | ISO224x | UNIT | |
|---|---|---|---|
| DWV (SOIC) | |||
| 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 96.3 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 36.9 | °C/W |
| RθJB | Junction-to-board thermal resistance | 60.1 | °C/W |
| ψJT | Junction-to-top characterization parameter | 16.9 | °C/W |
| ψJB | Junction-to-board characterization parameter | 58.2 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | °C/W |