ZHCSGU8E June 2017 – August 2018 ISO1211 , ISO1212
PRODUCTION DATA.
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 修訂歷史記錄
- 5 Pin Configuration and Functions
-
6 Specifications
- 6.1 Absolute Maximum Ratings
- 6.2 ESD Ratings
- 6.3 Recommended Operating Conditions
- 6.4 Thermal Information
- 6.5 Power Ratings
- 6.6 Insulation Specifications
- 6.7 Safety-Related Certifications
- 6.8 Safety Limiting Values
- 6.9 Electrical Characteristics—DC Specification
- 6.10 Switching Characteristics—AC Specification
- 6.11 Insulation Characteristics Curves
- 6.12 Typical Characteristics
- 7 Parameter Measurement Information
- 8 Detailed Description
- 9 Application and Implementation
- 10Power Supply Recommendations
- 11Layout
- 12器件和文檔支持
- 13機(jī)械、封裝和可訂購信息
封裝選項
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- D|8
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購信息
5 Pin Configuration and Functions
ISO1211 D Package
8-Pin SOIC
Top View
Pin Functions
| PIN | I/O | DESCRIPTION | |
|---|---|---|---|
| NO. | NAME | ||
| 1 | VCC1 | — | Power supply, side 1 |
| 2 | EN | I | Output enable. The output pin on side 1 is enabled when the EN pin is high or open. The output pin on side 1 is in the high-impedance state when the EN pin is low. In noisy applications, tie the EN pin to VCC1. |
| 3 | OUT | O | Channel output |
| 4 | GND1 | — | Ground connection for VCC1 |
| 5 | SUB | — | Internal connection to input chip substrate. Leave this pin unconnected on the board. |
| 6 | FGND | — | Field-side ground |
| 7 | IN | I | Field-side current input |
| 8 | SENSE | I | Field-side voltage sense |
ISO1212 DBQ Package
16-Pin SSOP
Top View
Pin Functions
| PIN | I/O | Description | |
|---|---|---|---|
| NO. | NAME | ||
| 1 | GND1 | — | Ground connection for VCC1 |
| 2 | VCC1 | — | Power supply, side 1 |
| 3 | EN | I | Output enable. The output pins on side 1 are enabled when the EN pin is high or open. The output pins on side 1 are in the high-impedance state when the EN pin is low. In noisy applications, tie the EN pin to VCC1. |
| 4 | OUT1 | O | Channel 1 output |
| 5 | OUT2 | O | Channel 2 output |
| 6 | NC | — | Not connected |
| 7 | |||
| 8 | GND1 | — | Ground connection for VCC1 |
| 9 | FGND2 | — | Field-side ground, channel 2 |
| 10 | IN2 | I | Field-side current input, channel 2 |
| 11 | SENSE2 | I | Field-side voltage sense, channel 2 |
| 12 | SUB2 | — | Internal connection to input chip 2 substrate. Leave this pin unconnected on the board. |
| 13 | SUB1 | — | Internal connection to input chip 1 substrate. Leave this pin unconnected on the board. |
| 14 | FGND1 | — | Field-side ground, channel 1 |
| 15 | IN1 | I | Field-side current input, channel 1 |
| 16 | SENSE1 | I | Field-side voltage sense, channel 1 |