4 Revision History
Changes from , to , (from Revision B (June 2017) to Revision C (December 2020))
- 將標(biāo)題 和特性 從DisplayPort 1.3 更改為DisplayPort 1.4Go
- 注:采用 MicroStar Jr. BGA 封裝的器件采用層壓 nFBGA 封裝進(jìn)行了重新設(shè)計。這種 nFBGA 封裝提供了類似于數(shù)據(jù)表中的電氣性能。該封裝占用空間也類似于 MicroStar Jr. BGA。將在整個數(shù)據(jù)表中更新全新封裝標(biāo)識符來代替已停止使用的封裝標(biāo)識符。Go
- 將 u*jr BGA 更改為 nFBGAGo
- Changed u*jr ZQE to nFBGA ZXHGo
- Changed DC2(p) to DC2(n) in Pin FunctionsGo
- Changed DC2(n) to DC2(p) in Pin FunctionsGo
- Changed u*jr ZQE to nFBGA ZXH. Updated thermal
data.Go
Changes from Revision A (July 2016) to Revision B (June 2017)
- 將標(biāo)題 和特性 從DisplayPort 1.3 更改為DisplayPort 1.4Go
Changes from Revision * (December 2015) to Revision A (July 2016)
- Changed DC2(p) to DC2(n) in Pin FunctionsGo
- Changed DC2(n) to DC2(p) in Pin FunctionsGo