ZHCS600D december 2011 – december 2020 HD3SS212
PRODUCTION DATA
| THERMAL METRIC(1) | HD3SS212 | UNIT | |
|---|---|---|---|
| nFBGA (ZXH) | |||
| 48-Ball | |||
| θJA | Junction-to-ambient thermal resistance | 64.9 | °C/W |
| θJCtop | Junction-to-case (top) thermal resistance | 28.7 | °C/W |
| θJB | Junction-to-board thermal resistance | 36.4 | °C/W |
| ψJT | Junction-to-top characterization parameter | 1.0 | °C/W |
| ψJB | Junction-to-board characterization parameter | 36.1 | °C/W |